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LE0563 is a thermoplastic semiconductive compound specifically designed for medium- high and extra-high voltage cable systems requiring improved grounding. It may be used either as a complete jacket or as a thin layer extruded on top of the regular jacket. This compounds permits easy diagnostic testing of the cable to ensure jacket conformity, allowing confirmation of fault-free cable before and after installation. It provides excellent mechanical
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.
