

DOWSIL™ EA-7300 Adhesive is a silicone adhesive which cures rapidly at lower temperatures than traditional heat cure products. A secondary moisture cure increases adhesion to create a long lasting, durable bond. High elongation and low modulus provide excellent stress relief for moving joints due to CTE mismatch or other environmental conditions. This product is suited for use in a variety of automotive electronic application such as control units, modules, sensors, and ADAS devices including under hood applications.
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.