CAPILENE E 78 EProducts
Carmel Olefins
DOWSIL™ SD 4518 Adhesive is a silicone pressure sensitive adhesive that, when used with SYL-OFF™ SL 7028 Crosslinker and SYL-OFF™ 4000 Catalyst, offers the ability to prepare pressure sensitive tape constructions at low curing temperatures. It also yields a stable release system when applied and cured on release liner coated with SYL-OFF™ Q2-7785 Coating. How to Use DOWSIL™ SD 4518 Adhesive is normally used with 0.09 parts per hundred SYL-OFF™ SL 7028 Crosslinker and 0.44 parts per hundred SYL-OFF™ 4000 Catalyst. First, add SYL-OFF™ SL 7028 Crosslinker to DOWSIL™ SD 4518 Adhesive and mix thoroughly, then add SYL-OFF™ 4000 Catalyst and mix further to preparation. The adhesive is supplied as a 45% (range 40–50%) non-volatile content product in n- Heptane. It can be further thinned with n-Heptane or other nonpolar solvents. Application to backing materials is accomplished via conventional tape coating equipment. ®™Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow DOWSIL™ SD 4518 Adhesive Page 2 of 3 © 2023–2024 The Dow Chemical Company. All rights reserved. Form No. 30-1485-01-0724 S2D How to Use (Cont.) When diluting with any solvent, refer to the solvent vendor’s safety data sheet for information on physical and health hazards associated with the solvent and use of ventilation, PPE, bonding and grounding or other measures that can minimize or eliminate these risks. Curing When used in the manufacture of adhesive tape, prepared DOWSIL™ SD 4518 Adhesive is normally coated onto flexible substrates such as polyester or polyolefin films. In this configuration, the adhesive can be cured at 150°C (302°F) for 3 minutes in a vented, continuous coating oven. Air flow patterns, air volume and velocity will have an impact on adhesive curing speed. Completeness of cure can be determined by laminating a test specimen to a steel panel, similar to a 180° peel test, and pulling the tape rapidly from the panel by hand. When completely cured, the adhesive will remain on the backing. If not fully cured, an adhesive residue will remain on the steel panel. NOTE: The catalyst in this adhesive system is required to obtain pressure sensitive adhesive
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.