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Dow one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.
