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Dow thermally conductive silicone encapsulants are supplied as two-part liquid component kits. When the liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, suitable for the protection of PCB systems applications where heat dissipation is critical. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow thermally conductive elastomers require no post- cure and can be placed in service immediately at operating temperatures of -45 to 200°C (-49 to 392°F) following the completion of the cure schedule. Long-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding PCB systems applications. With the increase in processing power and the trend toward smaller, more compact PCB system modules, the need for thermal management is growing. Thermally conductive silicones function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range. In addition to sustaining their physical and electrical

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