

Dow silicone 1-to-1 encapsulants are supplied as two-part liquid component. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well- suited for the protection of electrical/PCB systems assembly applications. Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning. Mixing and De-airing These products are supplied in a 1-to-1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 8 inches Hg (or a residual pressure of 10–0 mm of Hg) for 10 minutes or until bubbling subsides. Processing/Curing Thoroughly mixed Dow silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.