

DOWSIL™ TC-3065 Thermal Gel is one-part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 150 um thickness in thermal management application. It can be cured to elastic pad with certain tensile strength and elongation which can make sure the material can be peeled off easily and completely without residue in rework process. Application Methods Automated dispensing Stencil printing Processing/ Curing DOWSIL™ TC-3065 Thermal Gel can be dispensed or screen printed to various thickness and shapes and cured within 30 min at 100°C, or 1 hour at 80°C. To accelerate the curing speed, higher curing temperature can be adopted, for example the material can be cured within 20 minutes at 120°C. Before application, the suggested thawing time is 1 hour at room temperature (23°C). Working Time (Open Time) DOWSIL™ TC-3065 Thermal Gel starts curing slowly after being dispensed on substrates at room temperature. The viscosity increases over time, which means higher pressure is needed when pressing the gel to a certain thickness. The working time depends on the highest pressure applied on the devices allowed by the application. Generally the working time is over 5 days at room temperature. Adhesion and Re-workability In the manufacture of PCB system assemblies, it is often desirable to salvage or reclaim damaged or defective units. DOWSIL™ TC-3065 Thermal Gel has a good balance of adhesion and re-workability. On one hand, the adhesion strength to general substrates of thermal devices like heat sink (Aluminum, Al/Mg alloy) and encapsulated chip (epoxy surface) can resist the mechanical and climate reliability ageing test, on the other hand, the cured material can be peeled off completely without residue in rework process. ®™Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow DOWSIL™ TC-3065 Thermal Gel Page 3 of 4 © 2020 The Dow Chemical Company. All rights reserved. Form No. 11-4093-01-1220 S2D Useful Temperature Ranges For most
Melt Flow Index (MFI) at 230°C / 2.16 kg, density, polymer melting point and tensile strength. The full Technical Data Sheet (TDS) is available on request.
Suited to injection moulding and forming applications such as rigid containers, caps and engineering parts that demand high stiffness and dimensional stability.