11 4250 01 Dowsil Tc 6015 Thermally Conductive Encapsulant

DOWSIL™ TC-6015 Thermally Conductive Encapsulant is a two-component silicone encapsulant material. It is designed especially for use in the manufacture of electrical and PCB products and modules. It cures at room temperature or with heat to form elastic and thermally conductive encapsulant. Application Methods Manual or automated needle dispense. Mixing and De-airing DOWSIL™ TC-6015 Thermally Conductive Encapsulant is supplied in lot matched kits consisting of Part A and Part B in separate containers. During storage, some of the filler may settle at the bottom of the containers and should be individually homogenized prior to use. The two components should be thoroughly mixed using a weight or volume ratio of 1:1 until the mixture has a uniform color. Vacuum de-airing is recommended. A residual pressure of 10–20 mm mercury applied for 10 minutes will sufficiently de-air the material. Processing/Curing Apply the encapsulant, being careful to avoid air entrapment. Vacuum encapsulation is recommended for complex geometries. For information on appropriate dispensing equipment for your application, please contact local Dow TS&D. DOWSIL™ TC-6015 Thermally Conductive Encapsulant should be cured using one of the following recommended schedules:  30 minutes at 70°C  180 minutes at 25°C can reach ~15 shore A Large components and assemblies may require longer times in order to reach the curing temperature. ®™Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow DOWSIL™ TC-6015 Thermally Conductive Encapsulant Page 3 of 4 © 2021 The Dow Chemical Company. All rights reserved. Form No. 11-4250-01-1121 S2D Pot Life and Cure Rate Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to its final state. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed. Useful Temperature Ranges For most

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